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Diamond Wafeing Blade - Precision ultra-thin blade was used for circuit board cutting, due to the increased straight line performance, significantly reducing the cutting loss, Edge's ultra thin makes the rate of finished product is greatly improved. When cutting small, fragile or very hard materials, precision diamond cutting tools can ensure more accurate cutting of metal, make less material loss and distortion. The blade selection is based on the type of cut materials. Product features: 1.The precision ultra-thin diamond wafering blade, the surface RA of cutting work pieces can be up to 0.05μM , improve the grinding efficiency. 2.The incision of ultra-thin blade is only 0.5mm,maximum cut less cutting materials waste to cost saving. 3.The precision ultra-thin diamond wafering blade with Higher hardness, apply to a variety of cutting of hard and brittle materials, making wider cutting range and higher frequency of use.
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